Semiconductor Structures Assembly Laboratory

Laboratory capabilities:

  • assembly of semiconductor structures with dimensions from 2 x 2 mm to 8 x 8 mm on substrates with Au, Ag, Ni, Cu metallization using reflow process with SAC alloys, sintering technology using silver-based pastes, gluing technology with electroconductive pastes and a unique technology bare-Si joining for metallization of Au or Ag using silver-based pastes;

  • making wire connections using the ultracompression method using aluminum wires with a diameter of 25 mm to 100 mm, ultrathermocompression method using silver wires with a diameter of 25 mm and 50 mm and gold tape;

  • assembly of flip-chip structures up to 8 x 8 mm using SAC pastes and electrically conductive adhesives (H20E);

  • climate chamber tests of components and modules (chamber of 64 dm3, in the temperature range from -40oC to +180oC, for humidity tests the temperature range from +10oC to +95oC for relative humidity from 10% to 98%);

  • engraving and laser cutting.

 

Equipment:

  1. CAMMAX PRECIMA EBD65 – chip bonder for mounting chips on substrates

  2. CAMMAX PRECIMA FC300 – flip chip bonder for chip assembly using flip chip technology, assembly accuracy of several dozen micrometers

  3. CAMMAX PRECIMA PPS60-P – oven (hot plate) with precise control of the temperature profile up to 400°C, for the implementation of very accurate temperature profiles for soldering and gluing

  4. IRS 1000 – furnace for reflow soldering of printed circuit boards using short infrared

  5. MM500 – assembly manipulator from Mechatronika Sp. J. with a syringe dispenser and the ability to stack up to 100 elements

  6. Bonder for ultracompression UK4, manufactured by IBSPiE PW, connections established using Al wires.

  7. Ultrathermocompression bonder NFF009 53XXXBDA by FK DELVOTEC, connections using Au wires

  8. Technolab’s EasyInspector TD inspection system for optical inspection

 

The laboratory is located in the Faculty of Electrical Engineering Building, side staircase A, room no. 427 and 429.

Supervisor: Mariusz Sochacki, PhD, DSc