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• ASIC systems design for applications in medical technology, telecommunications, monitoring, space research, military technology, etc.,
• new generation integrated circuits and systems design for advanced nanoelectronic technologies,
• development of CAD software for new generation integrated circuits design,
• testing and multifactorial examination of prototype circuits and integrated systems.

Head of VLSI Design Division Witold Pleskacz, PhD, DSc tel: (+48) 22 234 5364, (+48) 22 234 7819 wew.23 e-mail: Electronics Building, room no. 370

VLSI Design Division: http://zmpwm.imio.pw.edu.pl

The Division operates within the Institute of Microelectronics and Optoelectronics, carrying out the teaching process as well as research and implementation activities in the Discipline of Automation, Electronics, Electrical Engineering and Space Technologies. Division members’ primary areas of research are electronics, nanotechnologies, Internet of Things (IoT), wireless control and measurement devices and networks, measurement automation, embedded software and photonics. The unique research infrastructure, under the substantive supervision of the Division members, allows for research and implementation work to be carried out on a vast range of scientific topics. These activities can support many areas of the economy - from telecommunications to transport, energy and medicine. Subsequent equipment investments (such as the POIG.02.01.00-14-138/08 project) constantly expand the possibilities and increase the research potential and technical capabilities of the Division, increasing the diversity of the research work carried out by the Division. The acquired knowledge and experience contribute to the implementation of many new, innovative projects. One of the most notable examples is the key position of the Division in the frame of cooperation with the Center for Advanced Materials and Technologies – CEZAMAT – which is one of the most significant high-technology projects in Poland and this part of Europe (for more information, go to: www.cezamat.eu).

Due to the planned revitalization of the semiconductor industry in Poland, which is primarily based on the capabilities of CEZAMAT PW, and in conjunction with the recently obtained ability to produce silicon CMOS integrated circuits (secure integrated circuits and for IoT purposes) and GaN power/high-frequency elements on a pilot scale, active participation of the Division employees is planned in this venture. A successful rollout of these technologies will stimulate further work on various aspects of the technology itself, but will also contribute to the development of dedicated diagnostic procedures and characterization techniques. In the latter case - both in the context of implementing and standardizing the measurements using electrical methods, as well as developing methodologies for interpreting the obtained results based on dedicated modeling methods and extracting the necessary electrophysical parameters assessing the state of technology and the quality of manufactured products. In these contexts, employees of the Division conduct research and supervise diploma theses preparation in the following topics:

• developing technologies for thin and ultra-thin dielectric, semiconductor and conductive layers,

• construction and design of test structures supporting deployment of new technologies (microelectronics, photonics and microsystems),

• optimization and design of electrical and optical properties of thin films for nanoelectronics as well as semiconductor photonic structures and devices,

• research on the electrical, optical and structural properties of semiconductor materials and structures,

• integration and research of low-dimensional (2D) materials and semiconductor nanocrystals in modern electronic and photonic devices,

• modeling and simulation of electronic and photonic structures and devices,

• modeling and simulation of electrical characteristics (static and dynamic) of nanoelectronic structures and devices,

• modeling of semiconductor technology processes,

• comprehensive design of electronic devices in such areas as measurement automation or industrial automation,

• design of analog-digital electronic devices,

• comprehensive design of embedded electronics devices, with particular emphasis on portable precision measurement automation devices,

• designing autonomous nodes of smart mesh, smart dust and IoT wireless sensor networks using energy-harvesting technology,

• hardware solutions to short- and long-range wireless communication problems based on the following technologies and standards, respectively: NFC, HDX, FDX, EPC and Bluetooth, SubGHz, WiFi, GSM, ZigBee (and others grouped under 802.15.4 standard).

Head of Microelectronic and Nanoelectronic Devices Division   Robert Mroczyński, PhD, DSc tel: (+48) 22 234 6065 e-mail: Electrical Engineering Building (GR), room no. 232B

Microelectronic and Nanoelectronic Devices Division website: http://zpmin.imio.pw.edu.pl

• silicon carbide (SiC) technology – thermal oxidation, reactive ion etching, metal/semiconductor contacts;

• manufacturing using PECVD, ALD and magnetron sputtering techniques, thermal treatment and characterization of dielectric layers with high electrical permittivity;

• characterization of broadband semiconductor materials - defect structure, surface condition, junctions, characterization of electrically active defects in cryogenic temperatures using DLTS and TSC techniques;

• design, modeling, manufacturing and characterization of high-power and high-frequency devices in broadband semiconductor technologies (SiC, GaN, diamonds) - Schottky diodes, PiN diodes, MOSFET transistors;

• construction of power electronic converters using power devices in SiC and GaN (gallium nitride) technologies;

• production and characterization of heterostructures and heterojunction devices for photodetection of UV, visible, gamma radiation and particles (ZnO, SiC, GaN, AlN, others);

• fiber optic sensors: refractive index, pressure, temperature, biosensors;

• production of layers for sensing applications employing vapor deposition techniques;

• SMD assembly technology on rigid, semi-rigid and flexible laminates, laser cut templates for paste screen printing, rigid and flexible laminates, semiconductor and glass substrates, reliability tests of printed circuits;

• technology for semiconductor devices microassembly.

Head of Electronic Materials And Microsystem Technology Division Mariusz Sochacki, PhD, DSc tel: (+48) 22 234 7932 e-mail: Electrical Engineering Building (GR), room no. 423C

Electronic Materials And Microsystem Technology Division website: http://zmime.imio.pw.edu.pl

• research and development of new laser and optoelectronic materials

• theoretical research and modeling of generation dynamics for various types of waveguide/fiber lasers and lasers based on second- and third-order nonlinear media

• theoretical and experimental research in modeling of passive and active optical nanostructures based on metamaterials, including hyperbolic metamaterials

• searching for new applications for nanophotonic circuits and systems

• design, construction and testing of lasers and fiber amplifiers

• design and characterization of optical fiber photonics elements (passive and active) and optical fiber systems

• design and characterization of integrated photonics circuits (ASPICs)

• design and testing of photovoltaic systems

• 2D and 3D television systems

• development of image processing and analysis methods for video monitoring systems in security systems

• design and testing of imaging systems for the VIS-IR-THz range

• testing of electronic and optoelectronic elements, circuits and systems in the radio and microwave band

• processing of radio frequency (RF) signals in the optical domain.

Head of the Optoelectronics Division Ryszard Piramidowicz, PhD, DSc tel: (+48) 22 234 1466 e-mail: Electrical Engineering Building (GR), room no. 128

Optoelectronics Division website: http://zo.imio.pw.edu.pl