Instytut Mikroelektroniki i Optoelektroniki serdecznie zaprasza na seminarium pt.: Heterointegration of multi-functional systems, Prof. Dr.-Ing. Dr. h.c. Karlheinz Bock z Technische Universitat Dresden. Seminarium odbędzie się sala seminaryjnej ISE - p. 229 w Gmachu Elektroniki 24 września 2015 o godz.10.00.

Abstract: Main objectives of systems heterointegration are the integration of different electronic components and functionalities like batteries, displays, microcontroller ICs, antennas, sensors and passive components on a flexible substrate, or a board or interposer.

These approaches enable the integration of various sensing, controlling and acting functionalities into anything on rigid, thin as well as on flexible and stretchable surfaces.

Thin silicon chips, foil integration technologies, 3D stacking of functional layers as well as 2.5 or 3D interposer technologies enable such new system concepts. Additive manufacturing, 3D printing as well as self-assembly and self-alignment processes seems to be a possibility to complement with classic thin- and thick-film technologies and are needed to meet the performance, reliability, energy and cost requirements of systems in the future. In the presentation packaging related aspects of heterointegration of multi-functional systems will be discussed at hand of examples.

KARLHEINZ BOCK is since 2008 a Professor of Polytronic Microsystems at the faculty of Communication and Electronics Engineering at the University of Berlin.  He earned his Diploma on electrical and communication engineering from the University of Saarland, Saarbrücken, Germany in 1986. He worked as a materials scientist and as a systems analyst and consultant before he joined the University of Darmstadt, Darmstadt, Germany in 1989 where in 1994 he received his Dr.-Ing. (Ph.D.) for RF microelectronics. In 2012 he received the Doctor honoris causa of the Polytechnical University of Bukarest in Romania for his work on Polytronics. On the 1st October 2014 Karlheinz Bock succeeded the previous chairholder and Director of the The Electronic Packaging Laboratory (IAVT), Prof. Dr.-Ing. habil. Dr. H. C. mult. Klaus-Jürgen Wolter.

Since 2001 he is employed as head of the Polytronic and Multifunctional Systems department at the Fraunhofer Institution for Modular Solid State Technologies in Munich working on advanced technology topics amongst them, thin silicon; thinning, dicing and handling and reliability of components; self-assembly of Si dies and other electronic components; super capacitances (super-Cap); foil and flexible electronics; organic electronics and sensors; 3D multifunctional and hetero-systems integration & packaging; MEMS acceleration sensors; medical electronics; implantable devices; biosensors with an annual research project volume of several Mio. €.

Karlheinz Bock has secured over € 50 Mio research funding and has been awarded more than 20 patents, and has published over 220 papers. He has given more than 50 invited presentations at universities, research institutions and international conferences and received the “Japan Society for Promotion of  Science (JSPS) Award” in 1994 for his PhD thesis. He co-authored 14 best paper awards amongst them the “He Bong Kim Award 2004” at CSMANTECH as well as at SPIE 2012, San Diego, USA and at MES 2012, Osaka Japan. Over the years he has been engaged in developing the technological community of 3D systems hetero-integration and packaging and organic and flexible electronics serving on many technical organizations and conferences.